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Shenzhen CaiNa Semiconductor Equipment Co., Ltd

Shenzhen,Guangdong,China China

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Ofertas de Venta: 4

RFID Flip-chip Bonging Machine

RFID flip-chip bonding machine RFM**0 Specifications: Dimension: **0mm***0mm***0mm Weight:*5KG P

RFID Flip-chip Bonder

RF****0 is a electronic label flip-chip assembly machine, through hot press to solidify and package, roll feed

RFID Testing Machine

TECHNICAL PARAMETERS SPECIFICATION: Dimension:***0mm***0mm***0mm Power:***0w Barometric Pressure:0.1MPaP0.7

RFID Flip-chip Bonding Machinery

RFM***0 flip-chip bonding machinery Machine Structure: 1. Adhesive dispensing: its the same with RF***0, w

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    Jocelyn < Shenzhen CaiNa Semiconductor Equipment Co., Ltd >

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