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Shenzhen,Guangdong,China China
RFID flip-chip bonding machine RFM**0 Specifications: Dimension: **0mm***0mm***0mm Weight:*5KG P
RF****0 is a electronic label flip-chip assembly machine, through hot press to solidify and package, roll feed
TECHNICAL PARAMETERS SPECIFICATION: Dimension:***0mm***0mm***0mm Power:***0w Barometric Pressure:0.1MPaP0.7
RFM***0 flip-chip bonding machinery Machine Structure: 1. Adhesive dispensing: its the same with RF***0, w
Persona de contacto Jocelyn chou
Dirección Shenzhen, Guangdong
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