Descripción del producto

ITEM PARAMETER Double side Multilayer Number of Layers 2layer 4layer**0layer Copper Thickness 0.***0 oz 0.***0 oz Base Board Thickness 0.**4.0 mm 0.**5.2 mm Incombustibility *4V - 0 *4V - 0 Peelable resistance *2.3N/cm *2.3N/cm Twist &#***4;0.5% &#***4;0.5% Insulation resistance &#***5;*0(*1)&#**7; &#***5;*0(*1)&#**7; Test voltage **0DCV ******0DCV Finished board area **0***0mm **0***0mm Min. Line Width and Spacing 0.1/0.1mm 0.1/0.1mm Copper thickness in hole &#***5;*5.0um &#***5;*5.0um Mini. pad diameter Inner layer 0.5mm Out layer 0.**6mm 0.**6mm Mini. Hole Diameter 0.*5mm 0.*0mm Hole tolerance PTH ±0.**6mm ±0.**6mm NPTH ±0.*5mm ±0.*5mm Hole location tolerance ±0.**6mm ±0.*5mm profile tolerance CNC Routing ±0.*1mm ±0.*1mm Punching ±0.**3mm ±0.**3mm Solder mask bridge ability &#***5;0.1mm &#***5;0.1mm Solder mask rigidity 6H 6H Solderable test **5&#***1; 5second **5&#***1; 5second Thermal cycling ability **8&#***1; *0second **8&#***1; *0second Surface Finishing OSP,HAL,Immersion AU,Soft Au Plating,Gold Finger OSP,HAL,Immersion AU,Soft Au Plating,Gold Finger Qaulity standard IPC-A***0F,IPC-ML***0 IPC-A***0F,IPC-ML***0