Descripción del producto

Material: CEM*3，FR*4(Normal to High Tg)，High CTI FR*4，PolyImide(PI) ，Aluminum Base 
Layer count: ***6L
Board thickness: 0.***6.0mm
Surface finish: HAL, HASL Leadfree, ENIG,Chem Tin, OSP,Gold Finger, Immersion Silver
Copper thickness: Min. base copper  1/4Oz, Max. base copper  6Oz
Max board size: *2.8X*7.2inch/**0X***0mm
Prepreg type: ***0, ***6, ***8, ***3, ***5, ***0.
Max. aspect ratio: *2:*1
Impedance control Tolerance: +/*7%
Min. Line Width/Space: 3/3mil
Slot size tolerance: ±0.**5mm(board thickness≤1.0mm)    ±0.*0mm (board thickness>1.*0mm)
Mechanical via pad: Inner Layer   0.4mm       Outer Layer  0.4mm
Min. Drilling bit: 8mil/0.2mm
Solder Mask Bridge: 0.2mm
PTH dia. Tolerance: ±0.**5mm/3mil(Standard), ±0.*5mm/2mil(Advanced)
Buried and Blind Vias: Sequence type