Wuhan Dike Surface Technology Co., Ltd

Usage: Brightener and leveling agent in nickel bath. BMP, used as nickel plating intermediates (nickel plating additives)

Stronger leveling agent in nickel bath. PPS, Used as nickel plating intermediates (nickel plating additives).

Stronger leveling agent in nickel bath. PPS-OH, used as nickel plating intermediates, nickel plating additives

Long-lasting Brightener and weak leveling agent in nickel bath. Used as nickel plating intermediates (nickel plating additives)

Long-lasting Brightener and weak leveling agent in nickel bath. PA, Used as nickel plating intermediates (nickel plating additives).

ALS, most often used as nickel plating intermediates and nickel plating additives. Also was called sodiumallysulfonate; SAS; SODIUM 2-PROPENE-1-SULFON

DEP, always used as nickel plating intermediates and additives. High purity and fulless to fine coating, does not dissolve in water, need to be used a

Chemical Name: dibenzenesulfonimide; Bis Benzene sulphonylimide Molecular formula:C12H11NO4S2 Molecular weight: 297.4 CAS NO. 2618-96-4

Acid copper leveling agent, dispersing agent, to improve the throwing power and eliminate the fogging phenomenon in LCD. Used as copper plating interm

For acid copper plating, decorative and functional availability coating (such as: printed circuit board). SPS, Used as copper plating intermediates (c