Nickel Plating Intermediates, Copper Plating Intermediates, Zinc Plating Intermediates, Alkaline Copper Brightener, Mpa, Beo, Bmp, Pap, Ps, Dep, Pabs, Hbops, Vs, Bbi, Lp, Sps, Mps, Wt, Bpc, Imz, Basic Yellow 1. From Wuhan Dike Surface Technology Co., Ltd

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Persona de contacto Ms. Miya Deng

Dirección NO.1 LINGJIASHAN SOUTH ROAD, OPTICAL VALLEY AVENUE, DONGHU DEVELOPMENT ZONE,WUHAN,CHINA., Wuhan, Hubei

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Butynediol propoxylate; BMP; Nickel Plating Intermediates

Usage: Brightener and leveling agent in nickel bath. BMP, used as nickel plating intermediates (nickel plating additives)

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Pyridinium propyl sulphobetaine; PPS; Nickel Plating Intermediates

Stronger leveling agent in nickel bath. PPS, Used as nickel plating intermediates (nickel plating additives).

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Pyridinium hydroxy propyl sulphobetaine; PPS-OH

Stronger leveling agent in nickel bath. PPS-OH, used as nickel plating intermediates, nickel plating additives

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Butynediol ethoxylate; BEO; Nickel Plating Intermediates (additives)

Long-lasting Brightener and weak leveling agent in nickel bath. Used as nickel plating intermediates (nickel plating additives)

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Nickel Plating Intermediates (PA)

Long-lasting Brightener and weak leveling agent in nickel bath. PA, Used as nickel plating intermediates (nickel plating additives).

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Sodium allylsulfonate

ALS, most often used as nickel plating intermediates and nickel plating additives. Also was called sodiumallysulfonate; SAS; SODIUM 2-PROPENE-1-SULFON

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Nickel Plating Intermediates (DEP)

DEP, always used as nickel plating intermediates and additives. High purity and fulless to fine coating, does not dissolve in water, need to be used a

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Bis Benzene sulphonylimide

Chemical Name: dibenzenesulfonimide; Bis Benzene sulphonylimide Molecular formula:C12H11NO4S2 Molecular weight: 297.4 CAS NO. 2618-96-4

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Basic Yellow 1; THIOFLAVINE T

Acid copper leveling agent, dispersing agent, to improve the throwing power and eliminate the fogging phenomenon in LCD. Used as copper plating interm

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Copper Plating Intermediates SPS ; Copper Plating Additives

For acid copper plating, decorative and functional availability coating (such as: printed circuit board). SPS, Used as copper plating intermediates (c

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Wuhan Dike Surface Technology Co., Ltd

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