***** INTERNATIONAL LIMITED

HDI 8-layer; FR-4; 0.8mm thickness; immersion gold;2 oz copper thickness; green solder mask; Min.hole size 0.1mm;special techinque: buried & blind via

12-layer; FR-4-TG170; 1.6mm board thickness; 1oz copper thickness; immersion gold; Min hole size 4mil; buried and blind via+ impedence control; ROHS.

Flex-rigid PCB; 0.8mm board thickness; 10z copper;buried and blind via;ROHS; lead free HASL;Min hole size 0.1mm;