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12H,Konka building,Hi-tech Industrial Park,Nanshan District, Shenzhen, PRC,Shenzhen,Guangdong,China China
Number of Layers 18 Base Material FR4/ High-TG/ Rogers/ Nelco/ RCC/ PTFE Copper Thickness 0.3~12oz Board Thickness 2.4mm Min. Hole Size 8mil Min. Line
This advertisement machine board was assembled by two boards. the mother board is 4 layers and the other board is 8 layers. the following is...
Min. Hole Size 0.25mm special process blind and buried via, peelable layers 12 Surface Finishing Im-gold + selective HASL Min. Line Width/space 4/4mi
Persona de contacto Siqi Zeng
Dirección 12H,Konka building,Hi-tech Industrial Park,Nanshan District, Shenzhen, PRC, Shenzhen, Guangdong
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