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Building 1, Cuigang Industry Park3, Huaide Villag,Shenzhen,Guangdong,China China
~Layers:8 Material:FR4 Thickness:1.0mm Width/Space:0.1/0.1mm Min.Hole Size:0.1mm Surface treament:ENIG+OSP ~Products include circuit board 2-30 lay
~Layers:10 Material:FR4 Thickness:1.6mm Width/Space:0.1/0.1mm Min.Hole Size:0.2mm Surface treament:ENIG+Gold Finger ~Products include circuit board 2
~Layer 4 gold-plated & heavy copper Board Layers:4 Material:FR4 Thickness:1.6mm Width/Space:175um/140um Min.Hole Size:0.4mm Surface treament:ENIG ~P
~Layer count: 6 layer Material: FR-4+PI Board Thickness: 1.60mm Min Line/Space: outer Layers: 0.09/0.09mm Inner Layers: 0.07...
~Layers:6 Material:Rogers4350+FR4 Thickness:1.6mm Width/Space:0.127/0.127mm Surface treament:ENIG+OSP ~Products include circuit board 2-30 layers, HD
Persona de contacto Mr. Ray Jia
Dirección Building 1, Cuigang Industry Park3, Huaide Villag, Shenzhen, Guangdong
We will contact you soon .
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