Precio FOB
Obtener el precio más reciente|
100 Piece Minimum Order
País:
China
N º de Modelo:
TE28F320C3TD70
Precio FOB:
Lugar de origen:
China
Precio de pedido mínimo:
-
Cantidad de pedido mínimo:
100 Piece
Detalle de embalaje:
-
El tiempo de entrega:
-
Capacidad de suministro:
10000 Piece per Day
Tipo de pago:
T/T
Grupo de productos :
Persona de contacto Mr. songhao
RM3022, Nan Guang Jie Jia Building, 3037 Shennan Road, Futian District, Shenzhen, Guangdong
Product
Features
â– Flexible SmartVoltage Technology
—2.7 V– 3.6 V Read/Program/Erase
—*2 V for Fast Production Programming
â– 1.*5 V–2.5 V or 2.7 V–3.6 V I/O Option
—Reduces Overall System Power
â– High Performance
—2.7 V– 3.6 V: *0 ns Max Access Time
â– Optimized Architecture for Code Plus
Data Storage
—Eight 4 Kword Blocks, Top or Bottom
Parameter Boot
—Up to One Hundred-Twenty-Seven *2
Kword Blocks
—Fast Program Suspend Capability
—Fast Erase Suspend Capability
â– Flexible Block Locking
—Lock/Unlock Any Block
—Full Protection on Power-Up
—WP# Pin for Hardware Block Protection
â– Low Power Consumption
—9 mA Typical Read
—7 A Typical Standby with Automatic
Power Savings Feature (APS)
â– Extended Temperature Operation
—–*0 °Cto**5 °C
â– ***-bit Protection Register
—*4 bit Unique Device Identifier
—*4 bit User Programmable OTP Cells
â– Extended Cycling Capability
—Minimum **0,**0 Block Erase Cycles
â– Software
—Intel
® Flash Data Integrator (FDI)
—Supports Top or Bottom Boot Storage,
Streaming Data (e.g., voice)
—Intel Basic Command Set
—Common Flash Interface (CFI)
â– Standard SurfaceMount Packaging
—**-Ball µBGA*/VFBGA
—**-Ball Easy BGA Packages
—**-Lead TSOP Package
â– ETOX™VIII (0.*3 µm) Flash
Technology
—*6, *2 Mbit
â– ***-bit Protection Register
—*4 bit Unique Device Identifier
—*4 bit User Programmable OTP Cells
â– Extended Cycling Capability
—Minimum **0,**0 Block Erase Cycles
â– Software
—Intel
® Flash Data Integrator (FDI)
—Supports Top or Bottom Boot Storage,
Streaming Data (e.g., voice)
—Intel Basic Command Set
—Common Flash Interface (CFI)
â– Standard SurfaceMount Packaging
—**-Ball µBGA*/VFBGA
—**-Ball Easy BGA Packages
—**-Lead TSOP Package
â– ETOX™VIII (0.*3 µm) Flash
Technology
—*6, *2 Mbit
País: | China |
N º de Modelo: | TE28F320C3TD70 |
Precio FOB: | Obtener el precio más reciente |
Lugar de origen: | China |
Precio de pedido mínimo: | - |
Cantidad de pedido mínimo: | 100 Piece |
Detalle de embalaje: | - |
El tiempo de entrega: | - |
Capacidad de suministro: | 10000 Piece per Day |
Tipo de pago: | T/T |
Grupo de productos : | IC components |