Descripción del producto
Glass epoxy tape
High TG Glass Epoxy Tape
Puncture Resistance Glass Epoxy Tape
Information:
High Tg Glass epoxy tape material for IC Chip Mounting
Features:
1. Excellent viscosity
2. Excellent in flame resistance
3. Excellent in adhesion to copper foil.
4. Excellent in insulation resistance
5.Excellent in chemical resistance
6. Cold curing (max.**0° C) is possible
Epoxy film tape characteristics:
1. UL approved temperature resistance up to **5 ° C and
flameproof
2. Epoxy film tape is resistant to welding, puncture resistance,
thin film, high dielectric strength and good shape.
3. a wide range of functions, help reduce inventory costs
Applications:
1.IC susbstrate for Smart card.
2.IC substrate for BGA,CSP or COB
3.Substrate for small LCD
Also recommend use on: the coil; capacitor; , wire
strapping
Chip package carrier tape / module package guide tape / IC chip
package guide tape / smart card chip package carrier tape / smart
card package guide tape
| País: |
China |
| N º de Modelo: |
-
|
| Precio FOB: |
(Negociable)
Obtener el precio más reciente
|
| Lugar de origen: |
China |
| Precio de pedido mínimo: |
- |
| Cantidad de pedido mínimo: |
- |
| Detalle de embalaje: |
- |
| El tiempo de entrega: |
15-20days |
| Capacidad de suministro: |
- |
| Tipo de pago: |
T/T |
| Grupo de productos : |
- |
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