Precio FOB
Obtener el precio más reciente1 ~ 2 / Unit
|10 Unit Minimum Order
País:
China
N º de Modelo:
GF1500
Precio FOB:
1 ~ 2 / Unit Obtener el precio más reciente
Lugar de origen:
USA
Precio de pedido mínimo:
1 per Unit
Cantidad de pedido mínimo:
10 Unit
Detalle de embalaje:
BOX
El tiempo de entrega:
3 DAYS
Capacidad de suministro:
1000 Unit per Day
Tipo de pago:
T/T
Grupo de productos :
Persona de contacto Carrie
Shenzhen, Guangdong
BERGQUIST GAP FILLER TGF ***0 is a two-part, high performance, thermally
conductive, liquid gap-filling material, which features exceptional slump resistance and
high shear thinning characteristics for optimized consistency and control during dispensing.
The mixed system will cure at room temperature and can be accelerated with the
addition of heat. Unlike cured thermal pad materials, a liquid approach offers infinite thickness
variations with little or no stress to the sensitive components during assembly. BERGQUIST
GF***0 exhibits low level natural tack characteristics and is intended for use in applications
where a strong structural bond is not required. As cured,BERGQUIST Gap Filler ***0 (Two-Part)
provides a soft, thermally conductive,form-in-place elastomer that is ideal for fragile assemblies
and filling unique and intricate air voids and gaps.
BERGQUIST GF***0 Typical Applications Include:
• Automotive electronics
• Computers and peripherals
• Between any heat generating semiconductor and a heat sink
• Telecommunications
Configurations Available:
• Supplied in cartridge or kit form
• With or without glass beads
País: | China |
N º de Modelo: | GF1500 |
Precio FOB: | 1 ~ 2 / Unit Obtener el precio más reciente |
Lugar de origen: | USA |
Precio de pedido mínimo: | 1 per Unit |
Cantidad de pedido mínimo: | 10 Unit |
Detalle de embalaje: | BOX |
El tiempo de entrega: | 3 DAYS |
Capacidad de suministro: | 1000 Unit per Day |
Tipo de pago: | T/T |
Grupo de productos : | GAP PAD SERIES |