8L, FR4, 1.6mm, ENIG, Gold fingers

Descripción del producto

Part Name: D.******1
Layer count: 8L
Material: FR4          
Thickness: 1.*0mm                      
Part Size: **7.*4* 1*0/1 up.     
Copper thickness : 1/1/1/1/1/1/1/1oz
Surface: ENIG
Solder: Green
Silkscreen: White            
Special: Gold finger/0.*3mmbga /0.2mmholes.


   Shenzhen Hemeixin Electronics Co., Ltd. established in ***0, a professional Rigid, Flex,Flex-Rigid PCB manufacturer. Factory covers 1,**0m2, monthly production capacity *0,**0m2,more than **0 employees. Initial investment *0 million RMB, has the capability to 
manufacture Rigid pcb up to *0 layers, multilayer Flex up to 8 layers, multilayer Rigid-
Flex up to *0+ layers (rigid area),contains single-sided to multilayer Rigid boards, Flex, Flex-Rigid PCB, MCPCB. 

   Feature boards including:  impedance, thick copper(up *8oz), thick gold(up to 6U), thick thickness(up to 6.0mm), hybrids, buried / blind vias, high frequency, flex, Rigid-flex PCB and other high-precision, high-difficulty PCBs. Comitted to fast prototype, small & medium volume pcb production, has formed an unique rapid production management system. Normally, 1L/2L,3wds lead time, multi-layers 5wds lead time. Express model can be completed within *4 hours of delivery, at delivery model to **0 variety. Excellent quality and delivery advantages to help customssers seize market opportunities.