BGA Solder Ball

Description

BGA Solder Ball
Product: Solder Ball
Product composition: tin *9.3 copper 0.7
Product size: *3mm *9mm *2mm
customizable
Product weight: can be customized
Solder balls are electrically conductive by using a heating tool to firmly bond two or more metal conductors. Solder balls are a kind of product in solder. Solder balls can be divided into lead solder balls and lead-free solder balls, both of which are used for circuit board soldering. Made of high-purity pure tin, its wettability and fluidity are very good, and it is simple and easy to apply tin. The welded points are bright and full, and there will be no bad virtual welding phenomenon. Adding appropriate antioxidant elements, the antioxidant capacity is greatly improved. Solder balls are mostly used in the processing and production of circuit boards. However, the commonly used solder balls are not uniform in the fusion process of flux and metal, which easily causes metal solution to splash, resulting in short circuit of products, and has a bad impact on the stability of product quality.