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Epoxy Resin Potting Compounds WOC-87-II(A)/2115(B)

Epoxy Resin Potting Compounds WOC-87-II(A)/2115(B)

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Yixing Pulitai Electronic Materials Co., Ltd.

Yixing Pulitai Electronic Materials Co., Ltd.

China

Miembro Básico

Persona de contacto Mr. Fang

No.41 East Shenxing Road,Nancao street,Wanshi Town, Wuxi, Jiangsu

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Description

Technical Data Sheet

  • Description
Two-component encapsulating system based on epoxy resin,formed from auxiliaries including epoxy resin, diluent, compound amine, cross-linking agent and defoamer by special production processing
 
Excellent of the surface gloss of the cured epoxy resin, excellent electrical properties and have flame retardant property. 
 
  • Applications
Encapsulation of electrical components of Capacitor, Igniter, Transformer, trigger and Filter.
 
  • General properties
Test Item Test Mothed/Conditions WOC***-II A ***5 B
Appearance Visualization Black viscous liquid Light dark brown liquid
Density *5º C g/m³ 1.*0 1.*5 1.0 1.*5
Viscosity *0º C mpa.s **0 - ***0 *0 - *0
Viscosity(blended) *0º C mpa.s  **0±**0
Storage validity Sealed and storage Temp.below *5º C  6 months 6 months
Ratio of blend Weight/Weight **0 ****5
Curing condition º C/hrs *5 º C/*4h or *0 º C/3h
 
  • Characteristics after curing
Item Unit/Conditions WOC***-II A/***5 B
Hardness *0º C Shore-D  ï¼ž*5
Insulation Strength *5º C kv/mm  ≥*8
Bending Strength Kg/cm2  ≥*2
Heat/cold Shock Resistance **0 to *0º C  Cycle times: more than 8
Flame Retardancy UL *4 V0 or V1
Surface Resistance *5º C Ω.cm  ï¼ž***4
Volume Resistance *5º C Ω.cm  ï¼ž***5
Curing Shrinkage Rate % ＜0.6
 
  • Storage, Packaging
1.       Sealed and storage Temperature below *5º C after each operation
2.       Please see the term of validity in each packages
3.       Packages: A component is *5kg, B component is *0kg or *5kg
The storage validity is 6 months, a little precipitate shall be occurred provided high temperature. Please stir the material before using

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