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4 Layer OSP+ENIG PCB

4 Layer OSP+ENIG PCB

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Headpcb

Headpcb

China

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Persona de contacto Headpcb

Shenzhen, Guangdong

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Description

Project Description

| Parameters
4 Layer 
Thickness: 1.2+/*0.*2 mm
Min Hole Size: 0.3 mm
Width/Space: 0.*2mm/0.*2 mm
Surface Treatment: ENIG

| Craft
Red Ink
ENIG+OSP

| Application
Consumer Electronics

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