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Customized W85Cu Tungsten Copper Alloy Electronic Packaging Mounting Base Plate

Customized W85Cu Tungsten Copper Alloy Electronic Packaging Mounting Base Plate

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Minimum Order

Place of Origin:

-

Price for Minimum Order:

-

Minimum Order Quantity:

-

Packaging Detail:

customized

Delivery Time:

-

Supplying Ability:

-

Payment Type:

PayPal, Western Union, L/C, T/T

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Miembro Básico

Persona de contacto Ms. Erin

No.8 Shayuan Road, Xiangtan, Hunan

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Description

Product Description:
It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and optical communication system.

Features:
a.High thermal conductivity;
b.Excellent hermeticity;
c.Excellent size control,surface finish and flatness Semi-finished or finished (Ni/Au plated) products available;

Product information:

 

Type

 

     Composition

 

                                               Properties

 

 

 

element

 

Content wt%

                                   Density

 

CTE ppm/K

 

TC,W/m·K

Mass density, g/cm3

Relative density, %T.D

 

W*0Cu

 

W
Cu

 

*0±1
balance

 

*7.0

 

≥*9

 

5.6~6.5

 

**0~**0

 

W*5Cu

 

W
Cu

 

*5±1
balance

 

*6.3

 

≥*9

 

6.3~7.0

 

**0~**0

 

W*0Cu

 

W
Cu

 

*0±1
balance

 

*5.4

 

≥*9

 

7.6~9.1

 

**0~**0

W*5Cu W
Cu
*5±1
balance
*4.7 ≥*9 8.5~9.1 **0~**0







 

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A:

Ms. Erin < Zhuzhou Jiabang Refractory Metal Co., Ltd. >

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