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Green laser cutting/depaneling machine

Green laser cutting/depaneling machine

150000 ~ 200000 / Unit ( Negotiable )

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Minimum Order

Place of Origin:

China

Price for Minimum Order:

Minimum Order Quantity:

1 Unit

Packaging Detail:

wooden carton

Delivery Time:

2months

Supplying Ability:

50 Unit per Month

Payment Type:

T/T, L/C

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Miembro Básico

Persona de contacto Ms. Jenny

Ground Floor, Building A, 2nd Taohuayuan Science & Technology Park, Xixiang, Baoan, Shenzhen, Guangdong

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Description

Features:
Powerful Cutting Capability
HERACLES***0/***0 is capable to cut all kinds of HDI board, PCBA, FPC, Rigid-Flex PCB within 3mm thickness, like semiconductor packaging board, camera module board for mobile phone, fingerprint identification module board and etc.. It could be set up within *4 hours, extremely convenient for urgent production.

High Production Capacity
According to our tests, HERACLES***0/***0 works stably with high efficiency, average UPH could be achieved to *0K, this production capacity equals to 3pcs of *0W UV laser cutting machine, *0pcs of millers or *0pcs of punchers.

Unique Technologies
Combined high-speed and accurate cuttings, adopted unique innovated technologies: continuous production module, repeatable loading & unloading system, embedded intelligent cutting system and etc., these technologies insure high production capacity, stability and accurate cutting.

Send a direct inquiry to this supplier

A:

Ms. Jenny < Shenzhen Musen Technology Co., Ltd >

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