Description

Our main products are polyimide(PI) film based 3 layers Flexible Copper Clad Laminate(3L-FCCL),also known as Copper Clad Laminate with adhesive.

Product Specifications：



Base Film: PI (Polyimide) film



Thickness of PI: 0.5/1mil (*2.5/*5um)



Thickness of copper foil: *2um**5um



Construction: Single/Double-sided



 



Features：



* Halogen-free 



* Excellent dip soldering resistance



* High bond and peel strength



* Good chemical resistance



* Good dimensional stability



* Excellent dielectric properties



* Good flammability and UL*4 V*0



 



 Application: FPC of Digital Products, Computers, laptop, Mobile Phone, printer, Aviation and Aerospace, automotive Fields, etc;