Description

Our main products are polyimide(PI) film based 3 layers Flexible Copper Clad Laminate(3L-FCCL),also known as Copper Clad Laminate with adhesive.
Product Specifications：

Base Film: PI (Polyimide) film

Thickness of PI: 0.5/1mil (*2.5/*5um)

Thickness of copper foil: *2um**5um

Construction: Single/Double-sided

 

Features：

* Halogen-free 

* Excellent dip soldering resistance

* High bond and peel strength

* Good chemical resistance

* Good dimensional stability

* Excellent dielectric properties

* Good flammability and UL*4 V*0

 

 Application: FPC of Digital Products, Computers, laptop, Mobile Phone, printer, Aviation and Aerospace, automotive Fields, etc;