Description
Base materials: high temperature FR4/FR5, halogen-free FR4,
aluminum based, polyimide, Rogers, Arlon, Other Teflon/PTFE
Layers: ***0 layers standard PCB, blind vias and buried vias
board
Minimum track space: 4mil/4mil, 3mils partial allowed
Maximum size: ***0mm x ***0mm
Minimum size: 3mm x 3mm
Surface copper thickness: maximum: 6/6 oz
Minimum: 0.5/0.5 oz
Hard gold thickness: maximum: *0 U
Maximum board thickness: 2.4.0mm
Finishes: SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hard &
soft gold, plating tin, immersion silver, immersion tin,
electroless nickel/immersion gold
