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|Minimum Order
Place of Origin:
-
Price for Minimum Order:
-
Minimum Order Quantity:
-
Packaging Detail:
PE bubble film , water-proof cloth and pallet
Delivery Time:
3~7working days after receipt of your payment
Supplying Ability:
3000 Kilogram per Week
Payment Type:
-
Persona de contacto Ms. Elaine
No.1 Hebei Industrial Park, Daland South Road, Longhua Town,, Shenzhen, Guangdong
Specifications
1.operating temperature up to **5 degree
2. Less distortion
3. Superior dimensional stability.
4.Excellent machined prosperity for wave solder pallets.
Synthetic materials
Color: black
Thickness: 3, 4, 5, 6, 8, *0 and *2mm,other thickness can be made specially
Size: ***0mmx***0mm;***0mmx***0mm
Certificate: SGS,MSDS
I. Description
Wave solder pallets materials is a heavy-duty glass fiber reinforced plastic which offers extreme strength and excellent electrical, thermal and chemical properties. Wave solder pallets materials is manufactured by using Polyester, Vinylester, Epoxid- and modified Epoxy resins combined with glass fibers.
It can keep it's mechanical strength,smoothness and original color when continuously used under the temperature of **0°c (max. working temperature below **5 degree *0~*0sec). It's applicable in ROHS applicance production line under high temperature continuously.
II. Main Characteristic
1. Normal working temperature at **0degree, operating temperature up to **5 degree.
2. Less distortion
3. Superior dimensional stability.
4. High temperature resistance
5. Resistance to chemical corrosion
6. High mechanical strength.
7.Good machinability (low density)
7. Low thermal conductivity
8. Light weight
9. Long life
*0. A certified anti-static material, anti-static index ups to *0^***0^9 per square.
II. Application
Wave solder pallets materials is suitable to wave soldering and SMT process. It can achieve the precision required during the SMT machining process, and maintain its flatness in the reflow soldering cycle. The low thermal conductivity prevents heat-shrinkage of the bas board, to ensure the quality of reflow process
The fixtures has the following functions, it can improve the efficiency of the peak soldering process:
1. Support thin baseboard or soft substrate circuit board
2. Carry an irregular shape solder pallet.
3. Use multi-pak panel design to improve production efficiency
4. Prevent the deformation of the solder pallet during high temperature reflow soldering process
5. Smoothly surface, good endurance, applicable for Teflon spray painting.
6. Avoid gold finger contamination by human contact.
7. Protect bottom side SMT components during the wave soldering process.
8. Prevent the deformation of the baseboard during the wave soldering process
9. Standardized the width of the production lines, eliminate the width adjustment of the production line
*0. Prevent baseboard being contaminated by the overflow of tin.