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printed circuits board

printed circuits board

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Shenzhen GoldApple electronics Enterprise

Shenzhen GoldApple electronics Enterprise

China

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Persona de contacto Ms. Sindy

Baoan, Shenzhen, Guangdong

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Description

Process description Number of layers: Four-side Material: FR**4 Board thickness: 1.2mm Plating process: tin-spray+Immersion gold Minimum via hole: 0.*5mm(6mil) Minimum line width: 0.*5mm(6mil) Minimum line space: 0.*5mm(6mil) Special process: Gold finger

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Ms. Sindy < Shenzhen GoldApple electronics Enterprise >

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