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printed circuit board (PCB)

printed circuit board (PCB)

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Shenzhen GoldApple electronics Enterprise

Shenzhen GoldApple electronics Enterprise

China

Miembro Básico

Persona de contacto Ms. Sindy

Baoan, Shenzhen, Guangdong

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Description

Process description Number of layers: six-side Material: FR4 High TG Board thickness: 1.6mm Plating process: gold plating Minimum via hole: 0.2mm(8mil) Minimum line width: 0.**7mm(5mil) Minimum line space: 0.1mm(4mil) Special process: resistance control

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Ms. Sindy < Shenzhen GoldApple electronics Enterprise >

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