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Spherical silica powder(Underfiller, EMC and so on )

Spherical silica powder(Underfiller, EMC and so on )

( Negotiable )

|

Minimum Order

Place of Origin:

CHINA

Price for Minimum Order:

-

Minimum Order Quantity:

50 Kilogram

Packaging Detail:

Packing by brown paper drum with 25kg net per drum (25Kg/Drum) or 25Kg net per pp bag within plastic

Delivery Time:

-

Supplying Ability:

50 Metric Ton per Month

Payment Type:

L/C, T/T

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Miembro Básico

Persona de contacto peng

Building 6 Area A Shuanghuayuan Nanli,Chaoyang District,, Beijing, Beijing

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Description

 

1.  Application

The SSP series of spherical fused silica powder have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the EMC, electronic packaging,Electronic adhesive,Copper Clad Laminate,Underfiller, daily chemical products and so on.

 

2.  Main Specifications

SiO2 Purity: *9.*5% min.

Size: D*0, 0.***0um per the user’s demands. 

layne
pengl $ sinosi , org

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A:

peng < SINOENERGY GROUP >

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