PCB prototype machine and pcb factory

Description

PCB prototype machine and pcb factory
PCB copy board
PCB schematic design

PCB Process Capability

·    processing layers:***8 layers

·    Finished thickness (thinnest - the thickest): 0.**8 "~ 0.*4" (0.*0mm ~ 6.0mm)

·    Minimum aperture: 6mil (0.*5mm)

·    Minimum line width / spacing :**4 mil (0.****0.*0mm)

·    Maximum board size: Single & Double *2 "x *3" (**0 x***0mm), Multi-layer *2 "x *5" (**0mm x **0mm)

·    Impedance Control: ± *0%

·    Surface Treatment: OSP,  HASL, Electric Nickel / Gold, Chemical nickel / gold, lead-free HASL , Gold finger, immersion Silver, Immersion Tin.

·    Base materials: FR4 ( ShengYi, KB, International), high TG (TG**0, TG**0), halogen-free board (Halogen-free), high frequency plate (Rogers, Teflon, Taconic), made PTFE (PTFE) ,, AL aluminum plate (Berquist, Al-made basis), copper (Cu Base), Iron (Fe Base), ceramic substrate (Ceramic Base)

FPC Process Capability

·    processing layers:**6 layers

·    Finished thickness (thinnest): 3mil (0.*8mm)

·    Minimum aperture: 4mil (0.*0mm)

·    Minimum line width / spacing: 2 mil (0.*5mm)

·    Maximum board size: *0 "x *5" (**0x ***0mm)

·    Surface Treatment: OSP,  HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold

·    Insulation resistance: ± ***1&branded; (Normal Normal

• Thermal shock resistance: **0 °C *0 sec.
• Processing materials: polyimide (PI), polyester (PET), polyimide (PI) + FR4