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Sell Underfilled Adhesive 5218

Sell Underfilled Adhesive 5218

FOB Price

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Minimum Order

Place of Origin:

CHINA

Price for Minimum Order:

-

Minimum Order Quantity:

5 Kilogram

Packaging Detail:

300ml/tube

Delivery Time:

-

Supplying Ability:

1 Piece per Month

Payment Type:

T/T

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Shenzhen Prosper Dobond Technology Co., Ltd

Shenzhen Prosper Dobond Technology Co., Ltd

China

Miembro Básico

Persona de contacto liu

donghuan, Shenzhen, Guangdong

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Description


Underfill Adhesive:BGA Glue.Suitable for filling of Mobile Phone’s and Computer’s main board,filling for many other kinds of Electronic Components’ main board,also can be used for bonding and filling of Lens’s components and other electronic components.

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liu < Shenzhen Prosper Dobond Technology Co., Ltd >

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