Description

Technical data: MANUFACTURING TECHNOLOGY
Pin fin heat sinks for SM devices are manufactured via the Cold Forging process
The cold forging process allows for the use of highly conductive copper and aluminum alloys
The process ensures that no air bubbles, cavities or any other impurities are trapped within the material MATERIALS
Aluminum pin fin heat sinks are forged from pure aluminum (AL***0)
The thermal conductivity of AL ***0 is ***0 BTU/in ft2 hr of. (~*0% higher than AL **0, a common cast alloy)
Copper pin fin heat sinks are forged from pure copper (CDA **0)
The thermal conductivity of CDA **0 is ***2 BTU/in ft2 hr of. (~**0% higher than AL **0, a common cast alloy). BASE FINISH
Pin fin heat sinks for SM devices are lapped
The lapping process significantly improves the flatness and the surface finish of the base of the heat sink, when compared to conventional base finishing processes
The contact resistance between the heat sink and the device is reduced significantly following the completion of the lapping process
Flatness: Better then 0.**1 inch/inch
Surface Finish: *6 RMS or better