Description

H Type Polyimide Film is a common polyimide film condensed with *-formic acid**-anhydride of benzene, and 4.*-diamino-biphenyl-ether oxide. This product has excellent mechanical capability, favorable electric insulation, radiation hardening and good dielectric at temperatures as low as ***9℃(***2.2℉) and as high as ***0℃(***2℉). F Type Polyimide Film is a combination of H Type film with FEP (F*6) fluorocarbon resin on one or both sides, it contains two types of FH and FHF. GT Type Polyimide Film is made by special technology.This product exhibited an excellentbalance of physical,chemical,and electrical properties over a wide temperature range,particularly at unusally higt temperatures And it not only has properties of normal PI film but also has good shrinkage and can match the coefficient of thermal expansion (CTE)ofcopper.