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Persona de contacto Mr. Michael
Room 1204, Incubation Building, Wuhan Institute of Technology, Wuhan, Hubei
Copper Electroplating Intermediates SPS Bis-(sodium sulfopropyl)-disulfide CAS NO.*********5, C6H*2Na2O6S BZ Strong leveling agent for acid copper plating can be obtained decorative and functional coatings. AP**4 Polyether compound, Leveling, and take place excellently. HGS Strong agent and uniform plating, with scattered strongly, bright mirror coating etc. PE*2 Brightener, stronger leveling agent in nickel bath BA Brightener, stronger leveling agent in nickel bath LZ*1 Blue dye Sulfur phthalocyanine dye, Acid copper leveling agent LZ*2 Purple dye Dye aggregation phthalazine, Acid copper leveling LZ*3 Yellow dye Alkaline Yellow, Acid copper filling agent MPS *-Propanesulfonic acid, *-mercapto-monsodium salt CAS NO. *********1, C3H7NaO3S2 UPS*-S-Isothiuronium propane sulfonate CAS NO. *********5, C4H*0N2O3S2 EDTP(Q*5) N, N, N&#**9;, N&#**9;-Tetrakis (*-hydroxypropyl) ethylenediamine, CAS NO. *******3, C*4H*2N2O4 1, *-PS 1, *-Propane sultone, CAS NO. ********4, C3H6O3S
