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Persona de contacto Ms. Sarah
A4 Tianfu Software Park, Chengdu, Sichuan
Project X represents the most advanced DDR3 memory available. It is developed and built in Super Talent’s Silicon Valley Engineering Labs to deliver the highest attainable DDR3 memory performance. Project X memory combines blistering fast clock speeds with aggressively tuned latencies. Project X employs an extreme cooling solution that offers double the surface area and **6% more aluminum mass than standard heat spreaders. With Super Talent’s special thermal adhesive, this cooling solution provides superior heat dissipation that results in a cooler, faster memory device. Super Talent builds Project X using the fastest available, carefully screened DRAM chips, and are hand tested as a matched pair in a popular enthusiast motherboard.
