Infrared ray BGA rework station

Description

Feature and Functions HS****8 is an excellent infrared ray BGA rework station, consisting of infraed ray desoldering(rework), soldering ion, pick up pen, adopts the advanced technology of infrared ray heating and ***** has the features of even heating andnon hot air blow, hadly affect the components around the work area of the PCB HS****8 is equipped with dual route temperature sensor to detect and monitor the temperature of the working area and the surrounding components of the PCB at the same time, to control the rework more accurately. HS****8 is appliehd to the soldering and desoldering work of SMD, CSP, LGA, QFP, PLCC as well as ball planting of BGA components, ideal for soldering and desoldering work of the mainborad of laptop, computer, mobile phone and game player ect. HS****8 Main Technical Parameters: Power Supply AC**0/**0V **0% *0Hz Whole Machine Power **0W Infrared Ray Lamp Heating Power **0W Pre-heating Power **0W Pre-heating Scope **0 X **0 mm Soldering Iron Power *0W Pre-heating Temperature Range ******0 degree Soldering Iron Temperature Range ******0 degree Sensor Temperature Range ****0 degree Desoldering Temperature Range ******0 degree Suction of Pick up pen ***0g Applicable component Size *0 X ****0 X *0 mm all components