Description

Technical requirements: Material: FR*4 Layer: 4 layer Thickness: 1.*0mm Copper thickness: 1oZ Solder mask: Green Surface Finishinge: Immersion Ni/Au Min.hole size: 0.*0mm Min.line width/space: 0.**7mm/0.**7mm ******************************************************************************* Reference - Our production capability for rigid PCB: 1)Layer Count : ***6 2)Max panel size : *0"**2" 3)***** board thickness : 0.*0mm 4)***** board thickness(1L*2L) : 3.2mm 5)***** board thickness(mulity-layer): 6.0mm 6)***** thickness : 0.1mm 7)***** drill size : 0.*0mm 8)Laser drilling : 0.***0.*5mm 9)Min.Line width/space : 3/3mil *0)Soldermask plug Via : 1.0mm(max) *1)Min.Solder dam width : 3.5mil *2)Space for mask between PAD : 8mil *3)Impedance control : +/**0% *4)***** thickness(inner) : 5oZ *5)***** thickness(outer) : 6oZ *6)Warp&twist : 0.*0% *7)Special Via : Blind via, Buried via, etc. *8)Surface Finishing : HASL Lead Free HASL OSP Flash Gold Immersion Gold Immersion Silver Immersion Tin Peelable Sold Mask Carbon Ink Gold Finger Thick Gold