Description

Features * Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function; * Color optical system with functions of split vision, zoom - in and micro- adjustment, equipped with aberration detection device; with auto focus and software operation function, *2X optical zoom; able to rework BGA sized up to *0mm×*0mm; * Touch screen interface, PLC control; able to display temperature curves and five detecting curves at the same time; * Color LCD monitor; * Built-in vacuum pump; **0° rotation in Φ angle; mounting nozzle is micro-adjustable; * 6 segments of temperature up (down) and 6 segments constant temperature control, **0 groups of temperature curve are stored; Curve analysis can be carried out on the touch screen and has the communication function as computers , with software attached; * Able to arrive at three independent temperature zones, temperature and time can be displayed digitally on the touch screen;able to rework CGA; * The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area; * Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range; * Both upper and lower hot-air heating head are movable on the IR preheating area to fit for reworking BGA in different positions on PCB; * Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle. * Driven by the servo motor, the integrative hot air head can store *0 groups of different BGA heating points and register marks.