3D Solder Paste Inspection Machine SPI

Description

3D Solder Paste Inspection Machine 3D SPI Features : Easy to use by fully motorize X-Y scan mechanism. Easy to program by Gerber image navigator Easy to repeat the same job by loading the saved program User-friendly color image live view operation Easy to monitor various 3D measurement data (Min./Max./Avg. Height, volume data and 3D shape image) *****(distance&area) More precise 3D data review by single cross-section profile 3D inspection function(Height/Volume/Coplanarity) SPC software including various charts& reports Warpage compensation The Importance of True 3D Solder measurement The key factors of solder paste quality are its height, volume and shape. 2D images provide only color, brightness and area information but not key ***** 3D measurement must be required to get information related to height, volume and shape. At least *0% defects of SMT manufacturing process occurs only during printing. The worse the quality of solder paste is, the more placement defects occur. The reliability of electronic products directly links to the solder joint quality and the quality of solder joint is effected by solder paste’s height, volume and shape. Without 3D solder measurement, there is no way to check the exact quality of printing. The earlier defects are found, the less repair cost is required. SMT DEFECT SPECTRUM OF THE PRINTING PROCESS NO SOLDER INSUFFICIENT SOLDER EXCESSIVE SOLDER BRIDGING ****0% Most people put all the emphasis on the AOI machine to detect the above defects which can be controlled effectively with a 3D SPI measurement system even before going through the reflow process