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via in pad PCB

via in pad PCB

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BICHENG ENTERPRISE LIMITED

BICHENG ENTERPRISE LIMITED

China

Miembro Básico

Persona de contacto Mr. Kevin

3-203, Shidai Jingyuan, fuyong,baoan, Shenzhen, Guangdong

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Description


1). *0 ***0mm/2up, FR*4
2). 6 layers at 1.4mm thick
3). *5 μm copper weight
4). Green solder mask LPI/White legend
5). ENIG surface finish
6). Blind via from Layer 1 to layer 2
7). Via in pad plugged conductive resin

1). *0 ***0mm/2up, FR*4
2). 6 layers at 1.4mm thick
3). *5 μm copper weight
4). Green solder mask LPI/White legend
5). ENIG surface finish
6). Blind via from Layer 1 to layer 2
7). Via in pad plugged conductive resin

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Mr. Kevin < BICHENG ENTERPRISE LIMITED >

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