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micro BGA PCB

micro BGA PCB

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BICHENG ENTERPRISE LIMITED

BICHENG ENTERPRISE LIMITED

China

Miembro Básico

Persona de contacto Mr. Kevin

3-203, Shidai Jingyuan, fuyong,baoan, Shenzhen, Guangdong

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Description


1). **7 x *5mm (2UP), FR*4 Tg **0
2). 1.6mm +/**0%, 6 layer
3). Min. hole 0.*5mm, 4/4 track/gap
4). Finished copper weight inner/outer 1 oz
5). Green solder mask/ White ident
6). Immerstion gold.
7). Fine pitch and micro BGA

1). **7 x *5mm (2UP), FR*4 Tg **0
2). 1.6mm +/**0%, 6 layer
3). Min. hole 0.*5mm, 4/4 track/gap
4). Finished copper weight inner/outer 1 oz
5). Green solder mask/ White ident
6). Immerstion gold.
7). Fine pitch and micro BGA

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Mr. Kevin < BICHENG ENTERPRISE LIMITED >

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