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wired modular jack

wired modular jack

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Shenzhen Xytom technology Co., Ltd

Shenzhen Xytom technology Co., Ltd

China

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Persona de contacto Mr. David

Futian, Shenzhen, Guangdong

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Description

MATERIAL • Housing: ABS RESIN (UL*4V*0) • Contact Pin: Phosphor Bronze, Hard gold plating over nickel • Plating: Gold Plating over nickel, gold plating thickness: 3u" / 6u" / *5u" / *0u" / *0u" SPECIFICATION • Voltage Rating: **5VAC RMS. • Current Rating: 1.5AMP • Contact Resistance: *0 Millionhms Max. • Insulation Resistance: **0 Megohms *@********************

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