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BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm , High-speed Read & Write Solution, eMMC Test, IC Socket
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BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm , High-speed Read & Write Solution, eMMC Test, IC Socket

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USB solution

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Sireda technology Co, Ltd

Sireda technology Co, Ltd

China

1st Año

Persona de contacto Rosa

Hanhaida High-Tech Park, Shenzhen, Guangdong

Contactar ahora

Especificaciones del producto

  • Type: USB
  • Application: eMMC eMCP

Descripción del producto

 
 
Item specifics
 
Package:BGA

Pitch:0.5mm

Pin Count:**1

IC Size:*1.5X*3mm

Structure:Clamshell

Contact:Spring Probe
 
Product Description
 
BGA**3 Socket USB Solution_ Pitch 0.5mm _ *1.5x*3mm ,High-speed Read & Write Solution,eMMC Test, IC Socket
 
 
 
***********-Open***********-Without lid***********-Close
 
 
 
Write and Read test speed up to **0.9MB/S(Test chip brand:Samsung, Part Number:KLMB*4GEND)
 
 
 
QQ*************3
 
 
 
 
 
Feature
 
 
 
Suitable for devices of  Samsung, Hynix,  Toshiba, Intel, Kingston etc eMMC and eMCP.
 
 
 
Support eMMC version: ≤eMMC5.0.
 
 
 
Support hot plug, eMMC can be directly connected to PC with USB port.
 
 
 
Realize reading, accessing and writting data for eMMC and eMCP devices
 
 
 
 
 
Specification
 
 
 
Meterial
 
Socket Body:PPS
 
Socket Lid:Aluminum Alloy
 
 
 
Mechanical
 
Contact types:Pogo Pin
 
Spring Force:*4.5gf 0.*5mm Travel
 
Operation Temperature: 0ºC to *0ºC 
 
Lift Span of operating travel:*0K Cycles Min 
 
Electrical
 
Current Rationg(Continuous):2A
 
DC Resistance:**0mohm  0.*5mm
 
 

País: China
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Tipo de pago: -
Grupo de productos : USB solution
BGA153 Socket USB Solution_ Pitch 0.5mm _ 11.5x13mm , High-speed Read & Write Solution, eMMC Test, IC Socket

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