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XC7Z030-2FFG676I integrated circuit from AMD-Xilinx
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XC7Z030-2FFG676I integrated circuit from AMD-Xilinx

1 ~ 562.9 / Tray ( Negotiable )

|

1000 Unit Minimum Order

País:

China

N º de Modelo:

-

Precio FOB:

1 ~ 562.9 / Tray ( Negotiable ) Obtener el precio más reciente

Lugar de origen:

-

Precio de pedido mínimo:

1 per Tray

Cantidad de pedido mínimo:

1000 Unit

Detalle de embalaje:

-

El tiempo de entrega:

-

Capacidad de suministro:

5000 Unit per Year

Tipo de pago:

T/T, L/C

Grupo de productos :

Contactar ahora
Miembro Básico

Persona de contacto Ms. Jessica

No. 15th Gaoxin South 7th Road,YueHai Ave, Shenzhen, Guangdong

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Especificaciones del producto

  • Brand Name: AMD - Xilinx
  • Type: FPGA; SoC; Xilinx Zynq-7000 series; Zynq-7000 All Programmable SoC (System on Chip)
  • Application: Communications, Embedded Systems, Medical Devices, Consumer Electronics
  • Operating Temperature: -40 - 100

Descripción del producto

We have been in this industry for *5 years, with major brands such as ADI, TI, Infineon, Xilinx, Intel, Microchip, NXP, etc. The price of the chips is not fixed; please feel free to ask for the latest offer at any time. (*/*: *@********************fer competitive prices and guarantee new, original, and genuine products with excellent after-sales service. 


The XC7Z****2FFG**6I is a member of the Xilinx Zynq****0 series, specifically a Zynq****0 All Programmable SoC (System on Chip). This device combines the features of an FPGA with a high-performance ARM Cortex-A9 processing system, making it highly suitable for a wide range of applications that require both programmable logic and embedded processing capabilities.

Key Features:

1. Processing System (PS): ARM Cortex-A9 Dual-Core Processor:
  • Clock Speed: Up to 1 GHz.
  • Architecture: **-bit RISC architecture, providing robust performance for embedded applications.
  • Cache: Includes L1 and L2 cache for efficient data handling and faster processing.
2. FPGA Fabric (PL):
  • Logic Cells: Approximately *0,**0 logic cells.
  • DSP Slices: **0 DSP slices for high-performance digital signal processing tasks.
  • Block RAM (BRAM): 1.8 Mb of block RAM for on-chip memory storage.
  • Configurable I/O: Wide range of I/O pins and support for various I/O standards.
3. Memory Interfaces:
  • DDR3/DDR2: Supports up to 1 GB of DDR3 or DDR2 memory, providing high-bandwidth memory access.
  • LPDDR2: Support for low-power DDR2 memory for power-sensitive applications.
4. Connectivity:
  • High-Speed Transceivers: Integrated transceivers supporting up to 6.6 Gbps for high-speed data transfer.
  • Gigabit Ethernet: Multiple Gigabit Ethernet interfaces for networking applications.
5. Package and Pin Count:
  • Package: ***-ball fine-pitch ball grid array (FBGA).
  • I/O Pins: Extensive number of I/O pins available for external connections.
6. Speed Grade:
  • *2: Standard speed grade, offering a balance between performance and power consumption.
7. Temperature Range:
  • Industrial Grade (I): Operates in a temperature range from **0°C to ***0°C, making it suitable for harsh environments and industrial applications.
8. Power Management:
  • Power Supply: The device supports various supply voltages, typically including 1.0V, 1.8V, 2.5V, and 3.3V.
9. Security Features:
  • Secure Boot: Secure boot capabilities for protecting against unauthorized firmware modifications.
  • Encryption: Support for cryptographic algorithms to enhance security.

Applications:

  1. Embedded Systems: Combining ARM processing with FPGA flexibility, suitable for applications like robotics, automotive, and industrial control systems.
  2. Communications: Ideal for high-speed communication systems and network processing.
  3. Medical Devices: Used in advanced medical imaging and diagnostic equipment.
  4. Consumer Electronics: Applied in consumer devices that require complex processing and custom logic.

País: China
N º de Modelo: -
Precio FOB: 1 ~ 562.9 / Tray ( Negotiable ) Obtener el precio más reciente
Lugar de origen: -
Precio de pedido mínimo: 1 per Tray
Cantidad de pedido mínimo: 1000 Unit
Detalle de embalaje: -
El tiempo de entrega: -
Capacidad de suministro: 5000 Unit per Year
Tipo de pago: T/T, L/C
Grupo de productos : Xilinx

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