Wood and Furnitrue industry Hot Melt Glue

Descripción del producto

1PUR***3,PUR***3B,PUR***0. Peactive PU HMA is heated and melted under chemical reaction inhibition condition to form fluid for easy coating. After cooling, the glue layer condensate and bind substrates, the moisture in the air and substrates surface react with glue layer to expand chain linkage to form high polymerization force polymers so that strongly increasing adhesion force, heat resistances and low temperature resistances. For its high reactivities, it has an excellent adhesion properties to all kinds of substrates. PUR****3 widely used for bonding of all kinds of high grade lamination floors. PUR****3B suitable for bonding of high grade lamination floors with higher density. PUR****0 suitable for profile shapes membraning and bonding. Vaccum Blistering Glue is a kind of one or two component, water-solubility emulsion, has low viscosity and excellent atomization properties. ***2&#****6;For thick PVC film (cabinet,etc.) vaccum blistering . ***0&#****6;For PVC film (door plank, furniture,etc.) vaccum blistering. ***6&#****6;For PVC film (door plank, office furniture,etc.) vaccum blistering. ***0&#****6;For thin PVC(audio, computer panel,etc.) vaccum blistering. 3. This product is one kind of water base vinyl PU emulsion, mixed with JL**5 curing agent, will cure at room temperature, has an excellent bonding properties to all kinds of substrates. JL***5 is the best emulsion for seedwood jointing. 4. Our Furniture Side Sealing HMA is composed of EVA, Sticker and solid thinner. It has excellent bonding strength, weath resistance, impact resistance, and storage stability. And it is harmless,ordourless. JF*1&#****6;For wood/Paper/Polyester/Melamine paper chips binded to hardwod, chipboard at low speed. JF*1B&#****6;For wood/Paper/Polyester/Melamine paper chips binded to hardwod, chipboard automaticaly. JF*1C&#****6;For wood/Paper/Polyester/Melamine paper chips binded to hardwod, chipboard at low temperature and low spped. JF***0, JF***1 ,JF***5 are all for plate alignment, rabbet, point jointing and side sealing HMA; under melting status, they belong to low, middle and high temperature opearation process respectively.