Descripción del producto

SiLICON POWDER AND MATERIALS
 
Physical Properties                       
Melting point ***0C
boiling point   ***5C
Density              2.*3g/cm3
Ec                          <5Us/cm
>PH                      >6.2
 
Purity
*9%- *9.**9%
 
Particle 
OEM
Can be produced upon customers request
Typical particle size
D*0 **0nm, D*0, **0nm, D*0 **0nm, D*0 1um, ***0um, ******5mesh, ***5mesh, ***0um, 1mm, **5mm, *0mm

â—ŽSPUTTERING TARGETS(CZ/THERMAL SPRAY)
1： Application
       Widely used in various types of optical glass, automotive glass construction, touch screen glass films.)
2：：Physical and chemical properties of the product
      Chemical Composition)：Si
      Moulding process：CZ/Casting/Thermal spraying
      Density :>2.*3g/cm3（>*9.8%)
      Resistivity：0.*2ohm.cm
      Purity:  *9.**9%
  Impurities content Max（Unit）：ppm
         Fe    0.5      Cu      0.5       Mo    0.5     
         Al    0.5      Mg     0.5        B        8
         Li     0.5      Ag      0.5        Ni       0.5
        Na    0.5     Pb      0.5        Zn      0.5
3： Size Max
    Rectangle: L**0*W**0*T*5mm
    Rotatable : ***0mmL
    Circle: OD**0mm
   
   Multi-assemblies bonded to copper backing plate
   Customize to customer specification