Descripción del producto

                          Reliability
Temperature Storage
 (1) Temperature: *5±2 , Duration: **0h , Recovery time: 2h±0.5h
 (2) Temperature: *0±3 , Duration: **0h ,Recovery time: 2h±0.*0.5h℃

Humidity TestConditions: *0±2 , *0~*5% RH Duration: **0h

Thermal Shock Heat cycle conditions: TA=**0±3, TB=*5±2,t1=t2=*0min, Switch ℃℃℃℃time: ≤3min , Cycle time: **0 times , Recovery time : 2h±0.5h.

Vibration FatigueFrequency of vibration: *0~*5Hz Amplitude:1.5mm

Directions: X,Y and Z Duration: 2h

Drop Test  Cycle time: *0 times Height: 1.0m

Solder Ability Test  Temperature: **5±5 Duration: 3.0s℃**5.0s℃

Depth: DIP**2/3 , SMD**1/5