Descripción del producto

Available in 2G and 3G versions, all AirPrime Q Series modules are footprint compatible. Make a single product design to communicate on any cellular network, anywhere in the world.

To simplify hardware integration into your product, its industrial-grade board-to-board connector offers a wide range of interfaces.

With its application framework and cloud-based device management services, the smart AirPrime Q Series modules accelerate your M2M deployment.

Choose the AirPrime Q Series to connect your solutions for the transportation, industrial, energy, healthcare and security sectors. 

Module:Q***6,Q***7,Q***8,Q*6Elite
Key Features

1. Connectorized *0 x *2.2 x 4mm form factor
2. Available in version for: GPRS, EDGE, HSPA+ and CDMA
3. Extended temperature to support industrial applications

1. Footprint compatible. Easy upgrade path between global 2G and 3G markets. Scale easily from one device to millions.
2. Lower deployment time and costs: LGA form factor allows high-volume automated production
3. Simplify M2M deployment and operations with application framework, development tools and pre-integrated secure cloud services