Descripción del producto

Min Thickness (Inner Layer Residue Copper 0.5oz, Resdiue Copper Rate *5%) 4L 6L 8L *0L *2L *4L *6 mils *4 mils *2 mils *0 mils *8 mils *6 mils Min/Max Layer Count Min 2 Layer, Max *2 Layer Min Inner Layer Thickness 4 mils Min Trace / Space 4/4 mils Protype 3/3 mils Copper (Thickness 1/ 3oz) Min Finished Hole Size 8 mils (Aspect Ratio 5) Drilling Accuracy ±3 mil Lamination Evenness ±3 mil Min Channel of SMD Pitch *0 mil Min Channel of SMD Pitch 8 mil Min DAM Between Fine Pitch 4 mil Min Space of Soldermask 4 mil Layer To Layer Registration Tollence ±3 mil ±3 mil ±3 mil ±3 mil ±3 mil ±3 mil Impedance Control Tollance **0 **0 ±*0%, *0 ±*0% Board Bow / Twist Tolerance < 0.*5% Min Length (V-Cut) 2 inch Max Width (V-Cut) *9 inch Min Width (V-Cut) 2 inch Min Board Thickness (V-Cut) *2 mils Golden Finger Max Width Beveling *0 mils Max Working Size *9 x *2.*4 inch