One Component UV Adhesive for Touch Glasses

PRODUCT FEATURE

• Fast cure
• One component
• Cures in shadowed areas
• Easy dispensability without stringing
• Fluorescent under UV light

APPLICATION

• For assembly process of electron product, especially protection of WLCSP and BGA on
  circuit board
• Suitable for glass, metal, PC substrate adhesion in industrial applications, typical
  application is mainly used for electronic components of moisture-proof protection.
   

  FAQ

• 1. Whats the minimum order quantity(MOQ)?
  - Minimum 1 unit, small batch and large volumes are acceptable.

  2. When can I get the quotation?
  - We usually respond within *4 hours on working days receiving your messages. After we receive the TDS report or sample, we will forward to you with quotation within one week.

  3. Which is the safe payment method to trade?
  - We accept T/T, LC, Paypal, Trade Assurance and Secure payment on Alibaba platform.

  4. How long does it take to deliver?
  - For standard adhesive, it will be 7 days for manufacturing. 
  - For non-standard adhesive, it will be negotiated customized according to your requirements.

  5. Whats the shipping method?
  - We are able to ship worldwide where Ocean shipping or Air shipping can reach.
  - We have a professional packaging team. Products will be packed safely and protectively.

  FACTORY INTRODUCTION

  Our Factory specializing in adhesives for semiconductor and electronic applications and surface protection materials for chip packaging and testing. Based on the core technology of adhesives, DeepMaterial has developed adhesives for chip packaging and testing, circuit board-level adhesives, and adhesives for electronic products. Based on adhesives, it has developed protective films, semiconductor fillers, and packaging materials for semiconductor wafer processing and chip packaging and testing. To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers,to solve the above-mentioned customers in process protection, product high-precision bonding, and electrical performance. Domestic substitution demand for protection, optical protection, etc.