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ODM Product Charger PCB Charging Module Printed Circuit Board Assembly ODM Product Charger PCB Charging Module Printed Circuit Board Assembly ODM Product Charger PCB Charging Module Printed Circuit Board Assembly ODM Product Charger PCB Charging Module Printed Circuit Board Assembly ODM Product Charger PCB Charging Module Printed Circuit Board Assembly
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ODM Product Charger PCB Charging Module Printed Circuit Board Assembly

Precio FOB

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( Negotiable )

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- Minimum Order

País:

China

N º de Modelo:

-

Precio FOB:

( Negotiable ) Obtener el precio más reciente

Lugar de origen:

China

Precio de pedido mínimo:

-

Cantidad de pedido mínimo:

-

Detalle de embalaje:

vacuum packing

El tiempo de entrega:

-

Capacidad de suministro:

-

Tipo de pago:

D/P, D/A, L/C, T/T

Grupo de productos :

-

Contactar ahora
Ruomei Electronic Technology Company Limited

Ruomei Electronic Technology Company Limited

China

Miembro Básico

Persona de contacto Ms. Eve

East Lake High-Tech Development, Wuhan, Hubei

Contactar ahora

Especificaciones del producto

  • Base Material: FR4 (Shengyi China, ITEQ, KB A+, HZ), HI-TG, FR06, Rogers, Taconic, Argon, Nalco, Isola and so on
  • Copper Thickness: 0.5-6 OZ
  • Min. Hole Size: 0.15mm(mechanical drill)/4mil(laser drill)
  • Min. Line Width: 3.5/4mil(laser drill)
  • Surface Finishing: Conventional HASL, lead free HASL, ENIG,Immersion gold(Hard Gold,Soft Gold),Immersion Silver......
  • Solder Mask:green, yellow, white, blue, black, red and so on

Descripción del producto

Layers
From single-sided to *2+ layers
Copper Thickness
0.**6 OZ
Material
FR4 (Shengyi China, ITEQ, KB A+, HZ), HI-TG, FR*6, Rogers, Taconic, Argon, Nalco, Isola and so on
Solder Mask
green, yellow, white, blue, black, red and so on
Finished Surface
Conventional HASL, lead free HASL, ENIG、Immersion gold（Hard Gold、Soft Gold）、Immersion Silver、Silver Plating、Lead free 、HASL）、Immersion Tin、Tin
Plating、OSP、Carbon、Platinum、ENENIG...
Silkscreen color
white, black
Products Type
HF(High-Frequency)&(Radio Frenquency)board, impendance controlled board, HDI board, BGA&Fine pitch board
Min. line width/gap
3.5/4mil(laser drill)
Min. hole size
0.*5mm(mechanical drill)/4mil(laser drill)
Min. Annlar Ring
4mil
Max Copper thickness
6OZ
Min Solder Mask Bridge
0.*8mm
Plugging Vias capability
0.**0.8mm

País: China
N º de Modelo: -
Precio FOB: ( Negotiable ) Obtener el precio más reciente
Lugar de origen: China
Precio de pedido mínimo: -
Cantidad de pedido mínimo: -
Detalle de embalaje: vacuum packing
El tiempo de entrega: -
Capacidad de suministro: -
Tipo de pago: D/P, D/A, L/C, T/T
Grupo de productos : -

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