Manual Color Optical Alignment BGA Soldering and Desoldering Station

Descripción del producto

Features Independent 3 temperature zones temperature control system Upper and lower hot air heating, which can heat up at the same time from the top of the component to the bottom of the PCB; bottom IR heating, temperature precision controlled in ±2°C. 8 segment temperature control and large area IR bottom preheating making PCB’s temperature equilibrium to avoid deformation and ensure soldering effect. Precise optical alignment system Passed CE and ISO

Technical Parameter Power Apply AC **0V±*0% *0/*0Hz Total Power Max ***0W Heaters’ Power Upper **0W,lower ***0W,IR ***0W Electrical Materials PLC, Color touch screen, High precision intelligent temperature control module Temperature controlling K-type thermocouple close-loop control, independent Temp. control, precision reach ±2°C Locating Way V-shape slot and omnipotent jig PCB Size Max **0×**0mm ,Min *0×*0 mm Applicable chips Max *0×*0mm ,Min 2×2 mm Overall Dimension L**0×W**0×H**0mm Temperature measurement interface 1 unit Weight of machine *0kg Color Black