Descripción del producto

Core Advantages
Smart Soldering
Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity.
Optimized Electrical Parameters
The working current is about *3A, which is perfectly adapted to mainstream string inverters.
Optimized Module Size
Large-format modules with M*0 wafer size use dual-glass and frame packaging to ensure module strength.
Gallium-doped Technology
Gallium-doped technology overcomes LID degradation and guarantees the long-term power generation of the module.
Smart Module Packaging and Logistics
Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics.
Bifacial Energy Yield
Additional power generation from the backside of bifacial modules increases the overall energy yield, which has been verified by customers and third-party testing organizations.
Mechanical Parameters
Layout:**4（6×*4）
Junction box:Split junction box, IP*8, 3 diodes
Weight:*2.3kg
Size:***6×***3×*5mm
Packaging:*1 pcs./pallet **5 pcs./*0GP **0 pcs./*0 GP **2 pcs./*3.5m FR **6 pcs./*7.5m FR