Descripción del producto

 Our LED lamp comprises a transparent cover, an LED lamp chip, a power supply, and a heat-dissipating structure. The heat-dissipating structure comprises a metal substrate or ceramic substrate, a Thermal Plastic Lamp Base, a Metal Glove and a heat-dissipating insulation layer. The difference lays in that the Thermal Plastic Lamp Base and Metal Glove is additionally introduced in the lamp base so as to transfer the heat generated by the LED lamp downward as well as the insulation. It will enhance the heat-dissipating capability of the lamp base without being limited to the upper part of the lamp base. Therefore, it is desirable to provide an improved heat-dissipating structure for an LED lamp to overcome the above-mentioned shortcomings and to thereby provide an aid for promoting sales of the LED lamp. Our new impose structure can be solved the high power with high voltage (***0V) LED lamp heat-dissipating as well as the insulation issue. It can meet with the current US, Euro and Japan giant LED lamp companies and fulfill with the new coming LED lamp specifications which will emphasize on high power LED lamp insulation safety. Due to the huge future demand on the Thermal Plastic for LED lamp heat-dissipating purposes, a lot of R&D is carrying out. Our Thermal Plastic materials are composed from High Thermal Conductivity Ceramic and Polyphthalamide (PPA). Our Thermal Plastic can relatively high conduct and withstand the heat generated from the LED lamp chips and act as good insulation.