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Bicheng Electronics Technology Co., Ltd

3-203, Shidai Jingyuan, fuyong, baoan,shenzhen,Guangdong,China

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High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB

High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB



9 ~ 99 / Unit ( Negotiable ) Obtener el precio más reciente


9 per Unit

1 Piece


10 working days

50000 Piece per Month



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Descripción del producto

High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB

RO4350B hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above.  
RO4350B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4350B material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.  
The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range.
RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions.
The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

Parameters of a type of 1.6mm RO4350B PCB
PCB SIZE 135 x 135mm=1PCS
BOARD TYPE High frequency PCB, RF PCB
Number of Layers Double sided PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ***---- 35um(1oz)+PLATE
RO4350B 60mil
copper ***---- 35um(1oz)+PLATE
Minimum Trace and Space: 11mil/12mil
Minimum / Maximum Holes: 0.3/2.2mm
Number of Different Holes: 5
Number of Drill Holes: 184
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control NO
Glass Epoxy:  RO4350B 60mil, Tg 288℃
Final foil external:  1.5oz
Final foil internal:  0oz
Final height of PCB:  1.6mm ±0.16
Surface Finish Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel)
Solder Mask Apply To:  NO
Solder Mask Color:  NO
Solder Mask Type: N/A
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo:  N/A
VIA Plated Through Hole(PTH)
Outline dimension:   0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance:  0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS*274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers

Data sheet (RO4350B )
RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
Z   10 GHz/23℃
2.5 GHz/23℃
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650
Volume Resistivity 1.2 x 1010   MΩ.cm COND A IPC-TM-650
Surface Resistivity 5.7 x109   COND A IPC-TM-650
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650
Tensile Modulus 16,767(2,432)
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
MPa(ksi) RT ASTM D 638
Flexural Strength 255
  IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650
Td 390   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.69   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0       UL 94
Lead-free Process Compatible Yes        



Persona de contacto:Mr. Kevin

Empresa:Bicheng Electronics Technology Co., Ltd

Dirección:3-203, Shidai Jingyuan, fuyong, baoan, shenzhen, Guangdong, China,518103


Mr. Kevin < Bicheng Electronics Technology Co., Ltd >
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