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High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB

País:

China

N º de Modelo:

BIC-001-V1.0

Precio FOB:

9 ~ 99 / Unit ( Negotiable ) (Negociable) Obtener el precio más reciente

Lugar de origen:

China

Precio de pedido mínimo:

9 per Unit

Cantidad de pedido mínimo:

1 Piece

Detalle de embalaje:

vaccume

El tiempo de entrega:

10 working days

Capacidad de suministro:

50000 Piece per Month

Tipo de pago:

T/T

Grupo de productos :

Contactar ahora

Descripción del producto

High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Circuit Board Patch Antenna PCB

RO4350B hydrocarbon ceramic laminates are designed to offer superior high frequency performance and low cost circuit fabrication. The selection of laminates typically available to designers is significantly reduced once operational frequencies increase to 500 MHz and above.

RO4350B material possesses the properties needed by designers of RF microwave circuits and matching networks and controlled impedance transmission lines. Low dielectric loss allows RO4350B material to be used in many applications where higher operating frequencies limit the use of conventional circuit board materials.

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range.

RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions.

The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

Parameters of a type of 1.6mm RO4350B PCB

PCB SIZE	135 x 135mm=1PCS
BOARD TYPE	High frequency PCB, RF PCB
Number of Layers	Double sided PCB
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ***---- 35um(1oz)+PLATE
	RO4350B 60mil
	copper ***---- 35um(1oz)+PLATE
TECHNOLOGY
Minimum Trace and Space:	11mil/12mil
Minimum / Maximum Holes:	0.3/2.2mm
Number of Different Holes:	5
Number of Drill Holes:	184
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	NO
BOARD MATERIAL
Glass Epoxy:	RO4350B 60mil, Tg 288â„ƒ
Final foil external:	1.5oz
Final foil internal:	0oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel)
Solder Mask Apply To:	NO
Solder Mask Color:	NO
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	NO
Colour of Component Legend	NO
Manufacturer Name or Logo:	N/A
VIA	Plated Through Hole(PTH)
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS*274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Typical applications are as follows:
Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID

Data sheet (RO4350B )

RO4350B Typical Value
Property	RO4350B	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.48±0.05	Z		10 GHz/23â„ƒ	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.66	Z		8 to 40 GHz	Differential Phase Length Method
Dissipation Factortan,δ	0.0037 0.0031	Z		10 GHz/23â„ƒ 2.5 GHz/23â„ƒ	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	+50	Z	ppm/â„ƒ	-50â„ƒto 150â„ƒ	IPC-TM-650 2.5.5.5
Volume Resistivity	1.2 x 1010		MΩ.cm	COND A	IPC-TM-650 2.5.17.1
Surface Resistivity	5.7 x109		MΩ	COND A	IPC-TM-650 2.5.17.1
Electrical Strength	31.2(780)	Z	Kv/mm(v/mil)	0.51mm(0.020")	IPC-TM-650 2.5.6.2
Tensile Modulus	16,767(2,432) 14,153(2,053)	X Y	MPa(ksi)	RT	ASTM D 638
Tensile Strength	203(29.5) 130(18.9)	X Y	MPa(ksi)	RT	ASTM D 638
Flexural Strength	255 (37)		MPa (kpsi)		IPC-TM-650 2.4.4
Dimensional Stability	<0.5	X,Y	mm/m (mil/inch)	after etch+E2/150â„ƒ	IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion	10 12 32	X Y Z	ppm/â„ƒ	-55â„ƒto288â„ƒ	IPC-TM-650 2.4.41
Tg	>280		â„ƒ TMA	A	IPC-TM-650 2.4.24.3
Td	390		â„ƒ TGA		ASTM D 3850
Thermal Conductivity	0.69		W/M/oK	80â„ƒ	ASTM C518
Moisture Absorption	0.06		%	48hrs immersion 0.060" sample Temperature 50â„ƒ	ASTM D 570
Density	1.86		gm/cm3	23â„ƒ	ASTM D 792
Copper Peel Stength	0.88 (5.0)		N/mm (pli)	after solder float 1 oz. EDC Foil	IPC-TM-650 2.4.8
Flammability	(3)V-0				UL 94
Lead-free Process Compatible	Yes