3-203, Shidai Jingyuan, fuyong, baoan,shenzhen,Guangdong,China
China
BIC-001-V1.0
9 ~ 99 / Unit ( Negotiable ) Obtener el precio más reciente
China
9 per Unit
1 Piece
vaccume
10 working days
50000 Piece per Month
T/T
-
PCB SIZE | 135 x 135mm=1PCS |
BOARD TYPE | High frequency PCB, RF PCB |
Number of Layers | Double sided PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
RO4350B 60mil | |
copper ------- 35um(1oz)+PLATE | |
TECHNOLOGY | |
Minimum Trace and Space: | 11mil/12mil |
Minimum / Maximum Holes: | 0.3/2.2mm |
Number of Different Holes: | 5 |
Number of Drill Holes: | 184 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | NO |
BOARD MATERIAL | |
Glass Epoxy: | RO4350B 60mil, Tg 288℃ |
Final foil external: | 1.5oz |
Final foil internal: | 0oz |
Final height of PCB: | 1.6mm ±0.16 |
PLATING AND COATING | |
Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel) |
Solder Mask Apply To: | NO |
Solder Mask Color: | NO |
Solder Mask Type: | N/A |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | NO |
Colour of Component Legend | NO |
Manufacturer Name or Logo: | N/A |
VIA | Plated Through Hole(PTH) |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
RO4350B Typical Value | |||||
Property | RO4350B | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 3.48±0.05 | Z | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline | |
Dielectric Constant,εDesign | 3.66 | Z | 8 to 40 GHz | Differential Phase Length Method | |
Dissipation Factortan,δ | 0.0037 0.0031 |
Z | 10 GHz/23℃ 2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 | |
Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.2 x 1010 | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 5.7 x109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 16,767(2,432) 14,153(2,053) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Tensile Strength | 203(29.5) 130(18.9) |
X Y |
MPa(ksi) | RT | ASTM D 638 |
Flexural Strength | 255 (37) |
MPa (kpsi) |
IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.5 | X,Y | mm/m (mil/inch) |
after etch+E2/150℃ | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 10 12 32 |
X Y Z |
ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
Tg | >280 | ℃ TMA | A | IPC-TM-650 2.4.24.3 | |
Td | 390 | ℃ TGA | ASTM D 3850 | ||
Thermal Conductivity | 0.69 | W/M/oK | 80℃ | ASTM C518 | |
Moisture Absorption | 0.06 | % | 48hrs immersion 0.060" sample Temperature 50℃ |
ASTM D 570 | |
Density | 1.86 | gm/cm3 | 23℃ | ASTM D 792 | |
Copper Peel Stength | 0.88 (5.0) |
N/mm (pli) |
after solder float 1 oz. EDC Foil |
IPC-TM-650 2.4.8 | |
Flammability | (3)V-0 | UL 94 | |||
Lead-free Process Compatible | Yes |
Persona de contacto:Mr. Kevin
Empresa:Bicheng Electronics Technology Co., Ltd
Dirección:3-203, Shidai Jingyuan, fuyong, baoan, shenzhen, Guangdong, China,518103
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