• Trace moisture causes failures to components and PCBs during high temperature reflow process. When absorbed moisture rapidly expand from high temperatures, common internal component damages and failures such as micro-cracking, blistering, popcorn effects will occur in moisture sensitive devices, packages and components. 
• Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination in PCB when moisture inside the layers causes expansion during the reflow process.

Eurekas dry cabinets, dry boxes, and desiccators will provide ultra-low humidity storage environment conforming to IPC/JEDEC J-STD **3 & IPC****1, storage and handling standards for MSDs and PCBs. Eureka Fast Super Dryer also dehumidifies during storage, providing alternative drying methods optimal for removing moisture in all moisture sensitive materials in SMT production, solving all moisture damage problems duringreflow process.

• Baking process uses high temperature to dry PCBs and will cause breakdowns of protective coatings, lead oxidation, intermetallic buildup and reduces solder ability of circuit boards.
• Nitrogen and dry air purge is costly and will only force moisture from the storage cabinet providing a humidity controlled environment. Nitrogen purging will not dry or remove moisture that has absorbed into the moisture sensitive materials, components or devices.

• When components are removed from moisture barrier bags, Eurekas ultra-low humidity storage cabinet will stop floor life clock for all IC packages such as:

• Drying and storage of multi-layer PCB and PWB before and after mounting, including dual side boards awaiting second side reflow.
• Moisture controlled storage with drying/desiccating capabilities for PCB pattern film/prepreg, quartz, fiber optics, CCDs, etc.
• PP plate (prepreg), Solder, Semi-mounted PCB, Mounted PCB, Die Cast & Mold compounds, Bonding materials, Fluorescence powder, LCG board, Wafer, CCD, Condenser, Oscillators, etc.​ 

• Stable and reliable humidity control storage options of <5% RH (XDC series), <*0% RH (SDC series), <*0% RH (TD series) or *0%~*0% RH (TUS series) 
• Fast recovery times in ambient temperature and pressure (NTP) conditions without using costly nitrogen (N2) or dry air purging. Solving all moisture related problems while increasing yield rates.
• Moisture is removed and expelled from the cabinets by the use of desiccant dehumidifiers which automatically regenerates. No fans are required to ventilate.
• Dual hydrometer sensor designs with independent hydrometer monitoring relative humidity levels inside the cabinet.
• Provides moisture sensitive devices indefinite floor-life meeting IPC/JEDEC J-STD **3 standards.  
• Eurekas dry cabinets will provide storage environment meeting IPC ***1 standards optimal for multi-layer Printed Circuit Board / Printed Wire Boards. 
• All of Eurekas Fast Super Dryer dry cabinets are equipped with anti-static paint, glass, casters and 1M ohm grounding cable meeting IEC*********1 (ESD) Standard.